Features:
Up to 1.25Gb/s bi-directional data links
Hot-pluggable SFP footprint
Extended case temperature range (0°C to +85°C )
Fully metallic enclosure for low EMI
Low power dissipation (1.05 W typical)
Compact RJ-45 connector assembly
Access to physical layer IC via 2-wire serial bus
1000 BASE-T operation in host systems with SERDES interface
10/100/1000Mbps compliant in host systems with SGMII interface
Compatible with RoHS